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Gain chip

Overview

IdealPhotonics' gain chip is a core optical amplification device based on semiconductor materials (such as InP/GaAs). It achieves stimulated emission amplification through carrier injection in the active region (multiple quantum wells/quantum dots), typically exhibiting 10-30dB gain and 100-1000mW output power. Its innovative "ridge waveguide" or "cone amplifier" structure achieves high efficiency (>50%) and low noise (

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Semiconductor optical amplifier chip

Product InformationModel Center wavelength Operate

1550nm SOA COC Chip MP-SOA-1550-30db-25-CoC 1550nm Add to Cart

1600nm SOA COC Chip MP-SOA-1600-30db-25-CoC 1600nm Add to Cart

1650nm SOA COC Chip MP-SOA-1650-30db-25-CoC 1650nm Add to Cart

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780-1330nm Gain Chip(TO package)

This is a TO-packaged semiconductor gain chip that serves as a gain medium for external-cavity semiconductor lasers or tunable diode lasers. Its core feature involves the application of deep anti-reflection (AR) coatings on one or both end faces of the chip, effectively suppressing the chip's intrinsic laser oscillation (self-excited). This design ensures the chip relies on external frequency-selecting components (such as diffraction gratings) to generate laser output, enabling wide tuning range and high side-mode suppression ratio (SMSR).

Product InformationModel Center wavelengthTuning rangeOutput powerForward current Operate

905nm 200mW TypeB Gain Chip (TO Package) MP-GC-905-90-200-To-B 905nm90nm200mW400mA Add to Cart

950nm 200mW TypeB Gain Chip (TO Package) MP-GC-950-110-200-To-B 950nm110nm200mW400mA Add to Cart

1030nm 110mW TypeB Gain Chip (TO Package) MP-GC-1030-160-110-To-B 1030nm160nm110mW200mA Add to Cart

1060nm 210mW TypeB Gain Chip (TO Package) MP-GC-1060-150-210-To-B 1060nm150nm210mW400mA Add to Cart

1105nm 200mW TypeB Gain Chip (TO Package) MP-GC-1105-130-200-To-B 1105nm130nm200mW400mA Add to Cart

1105nm 350mW TypeA Gain Chip (TO Package) MP-GC-1105-70-350-To-A 1105nm70nm350mW600mA Add to Cart

1150nm 210mW TypeB Gain Chip (TO Package) MP-GC-1150-110-210-To-B 1150nm100nm210mW600mA Add to Cart

1150nm 230mW TypeA Gain Chip (TO Package) MP-GC-1150-90-230-To-A 1150nm90nm230mW600mA Add to Cart

1180nm 220mW TypeA Gain Chip (TO Package) MP-GC-1180-80-220-To-A 1180nm80nm220mW600mA Add to Cart

1200nm 230mW TypeB Gain Chip (TO Package) MP-GC-1200-110-230-To-B 1200nm110nm230mW800mA Add to Cart

1260nm 120mW TypeA Gain Chip (TO Package) MP-GC-1260-60-120-To-A 1260nm60nm120mW400mA Add to Cart

1260nm 210mW TypeB Gain Chip (TO Package) MP-GC-1260-60-210-To-B 1260nm60nm210mW800mA Add to Cart

1270nm 200mW TypeA Gain Chip (TO Package) MP-GC-1270-60-200-To-A 1270nm60nm200mW800mA Add to Cart

1270nm 200mW TypeB Gain Chip (TO Package) MP-SOA-1270-130-200-To-B 1270nm130nm200mW800mA Add to Cart

1270nm 220mW TypeA Gain Chip (TO Package) MP-GC-1270-140-220-To-A 1270nm140nm220mW800mA Add to Cart

1310nm 200mW TypeA Gain Chip (TO Package) MP-GC-1310-60-220-To-A 1310nm60nm220mW 800mA Add to Cart

1325nm 200mW TypeB Gain Chip (TO Package) MP-GC-1325-60-200-To-B 1325nm60nm200mW800mA Add to Cart

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Three-Dimensional Photonic Interconnect Chip

The three-dimensional photonic interconnect chip is a high-precision optical interconnect device manufactured based on femtosecond laser direct writing technology. By constructing a three-dimensional optical waveguide network inside a glass substrate, it enables efficient transmission and spatial interconnection of multi-channel optical signals. The product supports conversion between different waveguide pitches and spatial arrangements, and offers advantages such as low transmission loss, high integration, compact structure, and flexible optical path design. It also supports 1310 nm and 1550 nm operating wavelengths and can be widely used in fields such as data center optical communication, optical modules, CPO co-packaged optics, and photonic integrated chip packaging, providing reliable optical path connection solutions for high-density, miniaturized optical interconnect systems.

Product InformationModel Operating wavelengthWaveguide transmission loss Operate

Three-Dimensional Photonic Interconnect Chip MP-3D-PIC 1310/1550 nm≤0.2 dB/cm Add to Cart

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  • 10+ 10 Years of Experience
  • 50 50 + Countries Bussiness
  • 10000 10k + Diodes sold worldwide
  • 30 30+ Invention patent
  • 10 10+ Advanced Optical Solutions

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