Three-Dimensional Photonic Interconnect Chip

The three-dimensional photonic interconnect chip is a high-precision optical interconnect device manufactured based on femtosecond laser direct writing technology. By constructing a three-dimensional optical waveguide network inside a glass substrate, it enables efficient transmission and spatial interconnection of multi-channel optical signals. The product supports conversion between different waveguide pitches and spatial arrangements, and offers advantages such as low transmission loss, high integration, compact structure, and flexible optical path design. It also supports 1310 nm and 1550 nm operating wavelengths and can be widely used in fields such as data center optical communication, optical modules, CPO co-packaged optics, and photonic integrated chip packaging, providing reliable optical path connection solutions for high-density, miniaturized optical interconnect systems.