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  • 795nm 0.13mW GaAs SM Low-Power VCSEL Die(Group 2)

    A Vertical-Cavity Surface-Emitting Laser (VCSEL) is a type of semiconductor laser whose laser beam emits perpendicularly from the top surface.Developed based on Gallium Arsenide (GaAs) semiconductor material, it is distinct from LEDs (Light-Emitting Diodes) and LDs (Laser Diodes). Its structure consists of mirror layers, an active region, and metal contact layers. The two emission mirrors are P-type and N-type Distributed Bragg Reflectors (DBR). The active region is composed of quantum wells. An ohmic contact is formed by depositing a metal contact layer on the surface of the P-type DBR, with a circular emission aperture fabricated on the P-type DBR for laser output.Die parameters: 2222; 795 nm; Single-mode; 1 M; S5, S6, S7; 0.13 mW; chip size 0.16×0.20 mm

    Product features:Ultra-low power consumption;High-temperature stability;Single-mode lasing property;High-density integration capability;Fast response speed

    Part Number:MP-VCS-795-0.13-DIE2-SM

    Application area:High-temperature electronic devices | Optical Interconnection | Biosensing | Consumer Electronics | Aerospace Applications

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    Main parameters
  • Core parameters
  • Center Wavelength

    795nm

  • Dimension Drawing
  • General Parameters

    Vixar Mold Drawing: Number of Hole Diameters

    664ac2eaef7a8.jpg 

     

    We currently have the following standard parts available for sample and mass production

    Standard portfolio – low-power chips

    Wavelength

    Mold details

    Suggest Max. Peak power
    CW, 100% DC

    Note

    Single-mode

    795nm

    0.16 mm x 0.20 mm single bore

    0.15mW

    Line width < 100MHz, +/- 0.5nm polarization stabilized

    895nm

    0.16 mm x 0.20 mm single bore

    0.2mW

    Line width < 100MHz, +/- 0.5nm polarization stabilized

    Multimodal

    680nm

    0.22 mm x 0.22 mm single bore

    7mW

    Visible light, increased efficiency, non-Gaussian beam shape polarization stability


    Standard portfolio – High power chip – 850 nm

    Mold details

    Suggest Max. Peak power
    CW, 100% DC

    Suggest Max. Peak power
    100 μs, 1% DC

    Suggest Max. Peak power
    5 ns, 0.1% DC

    0.52 mm x 0.52 mm
    100 apertures

    0.5W

    1W

    5W

    0.87 mm x 0.87 mm
    281 apertures

    2W

    6W

    13W

    0.90 mm x 1.00 mm
    550 bore sizes

    3W

    9W

    35W

    1.26 mm x 1.26 mm
    770 bore diameters

    4W

    12W

    36W

    1.99 mm x 1.99 mm
    1672 bore size

    6W

    20W

    78W

     

    Standard portfolio – High power chip – 940 nm

    Mold details

    Suggest Max. Peak power
    CW, 100% DC

    Suggest Max. Peak power
    100 μs, 1% DC

    Suggest Max. Peak power
    5 ns, 0.1% DC

    0.87 mm x 0.87 mm
    281 apertures

    2W

    6W

    13W

    0.90 mm x 1.00 mm
    550 bore sizes

    3W

    8W

    35W

    0.90 mm x 1.00 mm
    550 Bore Multi-Junction
    (3J)

    4W

    12W

    110W

    1.26 mm x 1.26 mm
    770 bore diameters

    4W

    11W

    36W

    1.99 mm x 1.99 mm
    1672 bore size

    6W

    20W

    76W

     

    VCSEL low-power chip GaAs 795nm Max. rating

    Ta = 80°C

    Parameters

    symbol


    value

    Operating/soldering temperature

    DC = 100%

    TS

    Min. value

    Max. value

    -20°C

    110°C

    Storage temperature

    Tstg

    Min. value

    Max. value

    -40°C

    125°C

    Forward current (maintain single mode)

    DC operation; DC = 100%; TS = 75°C

    If

    Max. value

    1.5 mA

    Forward current

    DC operation; DC = 100%; TS= 75°C

    If

    Max. value

    3mA

    Reverse voltage

    Not suitable for reverse operation

    ESD withstand voltage

    acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 1A)

    VESD

    Max. value

    250 V

    Note: Beyond jue to Max. Stress in the rated range can cause permanent damage to the equipment.


     Characteristics:

    Ta = 80°C, IF = 1.4 mA; DC = 100% - Group 3

    Parameters

    symbol


    value

    Forward current

    VF

    Typical values

    1.8   V

    Output power

    Φ

    Typical values

    0.13 mW

    Threshold current

    Ith

    Typical values

    0.75 mA

    Slope performance

    SE

    Typical values

    0.21 W / A

    Single-mode suppression ratio

    SMSR

    Min. value

    20 dB

    Polarization extinction ratio5)

    PER

    Min. value

    15 dB

    Peak wavelength

    λpeak-v

    Min. value

    Typical values

    Max. value

    794.5   nm

    795 nm

    795.5 nm

    Spectral line width

    Λlinewidth

    Max. value

    100   MHz

    FM modulation bandwidth

    Fm

    Min. value

    3.4 GHz

    Wavelength temperature coefficient

    TCλ

    Typical values

    0.055 nm / K

    Half-peak full-width field of view (50% of Φmax)

    φx

    φY

    Typical values

    Typical values

    12°

    12°

    1/e2 field of view

    φx

    φY

    Typical values

    Typical values

    20°

    20°

    Note: Wavelength, output power varies depending on the operating temperature and voltage.


    Relative Spectral Emission 1)

    6142d3d15981f.png

     

    Emission characteristics 1)

    6142d3e1d2bd1.png

     

    Forward current 1) 2)

    6142d3eeed3dc.png

     

    Optical Output Power 1) 2)

    6142d3fa3f327.png

     

    Packaging

    1731310805894680.jpg

     

    Notes:

    Depending on the mode of operation, these devices emit highly concentrated visible and non-visible light, which can be harmful to the human eye. Products containing these devices must follow the safety precautions given in IEC 60825-1.

    Among other substances, the subassemblies of the device contain metal-filled materials, including silver. Metal-filled materials can be subject to environmental influences that contain aggressive substances. Therefore, we recommend that customers minimize the exposure of equipment to corrosive substances during storage, production and use. When tested using the above tests, devices that showed visible discoloration did not show performance deviations within the fault limits for the specified test duration.

    The corresponding fault limits are described in the IEC60810.

     

    terminology

    1) Typical values: Due to the special conditions of the semiconductor device manufacturing process, typical data or computational associations of technical parameters can only reflect statistics. These do not necessarily correspond to the actual parameters of each product, which may differ from the typical values and calculation of the relevant or typical characteristic lines. These typical values data will be changed without notice due to technical improvements.

    2) Test temperature: TA = 85°C ± 2°C

    3) Dimensional tolerance: Unless otherwise specified in the drawing, the tolerance is specified in ±0.1 and the size is specified in mm.

    4) Wavelength: Continuous wavelength measurement with a resolution ± 0.1 nm.

    5) Polarization: Under mold stress conditions caused by mounting or encapsulation, the polarization extinction ratio decreases.

     

    Ordering information

    Description

    Working mode

    Order code

    Group 1 - Die; 2222; 795; S; 1M;

    S5,S6,S7; 0.13mW; 0.16X0.20mm

    Ta   = 60±10°C; IF = 1.4 mA; DC = 100%, 795nm

    V00145 Group: 1

    Group 2 - Die; 2222; 795; S; 1M;

    S5,S6,S7; 0.13mW; 0.16X0.20

    Ta    = 70±10°C; IF= 1.4 mA; DC = 100%, 795nm

    V00145 Group: 2

    Group 3 - Die; 2222; 795; S; 1M;

    S5,S6,S7; 0.13mW; 0.16X0.20mm

    Ta    = 80±10°C; IF = 1.4 mA; DC = 100%, 795nm

    V00145 Group: 3

    Group 4 - Die; 2222; 795; S; 1M;

    S5,S6,S7; 0.13mW; 0.16X0.20mm

    Ta    = 90±10°C; IF = 1.4 mA; DC = 100%, 795nm

    V00145 Group: 4

    Group 5 - Die; 2222; 795; S; 1M;

    S5,S6,S7; 0.13mW; 0.16X0.20mm

    Ta  = 100±10°C; IF = 1.4 mA; DC = 100%, 795nm

    V00145 Group: 5


    Optional Configurations

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  • Product title: 795nm 0.13mW GaAs SM Low-Power VCSEL Die(Group 2)
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