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  • 1300nm Booster Optical Amplifier on Submount

    A high-power boost optical amplifier (BOA) with a center wavelength of 1300nm and packaged in a chip on carrier (CoC). This product belongs to the MP series carrier integrated optical amplifier, designed specifically for application scenarios that require high gain, low noise, and compact integration.

    Product features:High-gain and low-noise amplification; compact submount integration; wide operating wavelength range; intelligent power control; extreme environmental adaptability

    Part Number:MP-BOA-1300-150-60-CoC

    Application area:Submarine cable relay; space laser communication; military optoelectronic systems; fiber sensing networks; free-space optical communication

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    Main parameters
  • Core parameters
  • Central Wavelength Saturation Output Power Bandwidth

    1300nm 22dBm 60nm

  • Dimension Drawing
  • General Parameters

    Detailed Specifications

    Recommended Operating Conditions

    @ CW, device mounted on a copper heat sink

    Parameter

    Min.

    Typ.

    Max.

    Unit

    Heat Sink Temperature

    20

    25

    30

    °C

    Forward Current

    2000

    3000

    mA

    Output Power (Amplification Mode)

    450

    mW

    Input Optical Power*

    -20

    10

    15

    dBm

    * Fiber-to-chip coupling efficiency taken into account.

     

    Gain Characteristics

    @ CW, 25°C, 2000 mA, Input Signal: 10 dBm, 1300 nm(筱晓Id3401 标黄部分改成1300)

    Parameter

    Min.

    Typ.

    Max.

    Unit

    Forward Current @ 450 mW

    3000

    mA

    Saturated Output Power @ -3 dB

    18

    22

    dBm

    Gain

    13

    17

    dB

    Small-Signal Gain @ -20 dBm

    25

    31

    dB

    Peak Wavelength

    1290

    1300

    1310

    nm

    Bandwidth @ -3 dB

    60

    nm

    Noise Figure @ Pin = -20 dBm (Excluding input coupling)

    5

    dB

     

    ASE Characteristics

    @ CW, 25°C, 2000 mA, No Input Signal

    Parameter

    Min.

    Typ.

    Max.

    Unit

    Output Power (Per Port)

    45

    mW

    Forward Voltage

    1.4

    2

    V

    Average Wavelength

    1202

    nm

    Bandwidth (FWHM)

    17

    nm

    Ripple (RMS)**

    0.05

    1

    dB

    Slow-Axis Beam Divergence (FWHM)

    2

    6

    10

    deg

    Fast-Axis Beam Divergence (FWHM)

    22

    27

    33

    deg

    Polarization Extinction Ratio (PER)

    14

    18

    dB

    Polarization

    TE

    ** Measured within 1 nm range near the spectral maximum at 20 pm resolution.

     

    Absolute Maximum Ratings

    Parameter

    Min.

    Max.

    Unit

    Output Optical Power

    1300

    mW

    Input Optical Power

    20

    dBm

    Forward Current

    4000

    mA

    Reverse Voltage

    2

    V

    Soldering Temperature (Max. 5 s)

    250

    °C

    Chip Operating Temperature (Above Dew Point)

    5

    50

    °C

    Storage Temperature

    5

    50

    °C

     

    Chip Parameters

    Parameter

    Min.

    Typ.

    Max.

    Unit

    Chip Length

    8

    mm

    Front Facet Back Reflection

    0.001

    %

    Rear Facet Back Reflection

    0.001

    %

     

    Model Description

    Characteristic Curves

    Typical Performance (For Reference Only)

    Output Power and Operating Current

    2.1.png

     

    Gain Spectrum

    2.2.png 

     

    Gain and Output Power

    2.3.png

     

    Output Power vs. Input Power

    2.4.png 


    Amplified Spectrum

    2.5.png 

     

    ASE Spectrum

    2.6.png 

     

     

    Operating Instructions

    Safety and Operating Instructions

    The light emitted by this device is invisible and hazardous to human eyes. Avoid direct viewing of the fiber connector while the device is in operation. When operating with the connector uncovered, appropriate laser safety goggles must be worn.

    Absolute maximum ratings shall only be applied to the device for a short duration. Long-term exposure to maximum ratings or simultaneous exposure to multiple maximum ratings may cause device damage or reliability degradation. Operation beyond the device’s maximum ratings may result in equipment failure and potential safety hazards. A dedicated matched power supply must be adopted to ensure the maximum forward current is not exceeded.

    Devices mounted on heat spreaders require a qualified heat sink. The device shall be fixed to the heat sink with 4 screws (fastened in a cross pattern with an initial torque of 0.075 N·m and a final torque of 0.15 N·m) or clamps. The flatness deviation of the heat sink surface shall be less than 0.05 mm. Indium foil or flexible thermal interface materials are recommended between the device base and the heat sink. Thermal grease is not recommended for this application.

    Prevent optical back-reflection, which may degrade the device’s spectral performance and output power stability, and even cause catastrophic facet damage. An optical isolator is strongly recommended to suppress back-reflection.

    Do not pull the optical fiber. Avoid bending the fiber with a bending radius less than 3 cm. The fiber end-face shall be fully protected against contamination and mechanical damage during installation. After removing the dust cap, clean the fiber end-face unidirectionally with lens cleaning wipes or cotton swabs moistened with isopropyl alcohol or ethanol. Operate the device only with clean optical fiber connectors.

    ESD Protection

    Electrostatic discharge is a primary cause of unexpected product failure. Strict ESD precautions must be implemented at all times. Maintain continuous ESD protection during installation, including the use of anti-static wristbands, grounded work surfaces, and standardized anti-static operating procedures.

    667a775f5d715.png 

     

    Optional Configurations

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  • Product title: 1300nm Booster Optical Amplifier on Submount
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