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1210nm 9W High-Power Broad-Area Laser Diode
Proprietary mirror coating technology, high reliability, reliable Au/Sn bonding between the chip and composite submount, RoHS compliant.
Product features:High power output;Broad emission area;Efficient heat dissipation;High electro-optical efficiency;Industrial-grade packaging
Part Number:MP-BAL-1210-9W-Coc
Application area:Fiber laser pumping | Industrial processing | Medical equipment | Defense applications | Scientific research experiments
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Output Power Center Wavelength Bandwidth Stripe Width
9 W 1210 nm 10 nm 250 μm

Recommended Operating Conditions (Unit mounted on copper heat sink)
Parameter | Min. Value | Typ. Value | Max. Value | Unit |
Heat Sink Temperature | 20 | 25 | 30 | °C |
Forward Current | - | 17 | 18.5 | A |
Output Power | 0.9 | - | 9 | W |
Parameter | Min. Value | Typ. Value | Max. Value | Unit |
Forward Current @ 9 W | - | - | 18.5 | A |
Forward Voltage | - | 1.4 | 1.9 | V |
Threshold Current | - | 1 | 1.4 | A |
Average Wavelength | 1200 | 1210 | 1220 | nm |
Bandwidth (FWHM) | - | 10 | 14 | nm |
Wavelength Tunability vs. Temperature | - | 0.5 | - | nm/°C |
Slow-Axis Beam Divergence (FWHM) | 4 | 9 | 14 | deg |
Fast-Axis Beam Divergence (FWHM) | - | 27 | 35 | deg |
Stripe Width | - | 250 | - | μm |
Polarization | - | TE | - | - |
Absolute Maximum Ratings
Parameter | Min. Value | Max. Value | Unit |
Output Power | - | 10 | W |
Forward Current (CW) | - | 19 | A |
Reverse Voltage | - | 2 | V |
Soldering Temperature (max. 5 seconds) | - | 250 | °C |
Operating Temperature (above dew point) | 5 | 60 | °C |
Storage Temperature (above dew point) | -40 | 85 | °C |
Typical Performance
L-I-V characteristic graph
Optical Spectrum(Resolution 1nm)
Slow-axis far-field
Far-axis far-field
The laser emitted by this device is invisible and harmful to the human eye. When the device is operating, avoid direct viewing of the fiber output or collimated beams along its optical axis. Always wear appropriate laser safety goggles during operation.
Absolute Maximum Ratings are only for short - term application to the device. Long - term exposure to Maximum Ratings or exposure to one or more Maximum Ratings may cause device damage or affect device reliability.
Operation outside the product's Maximum Ratings may lead to device failure or safety hazards. Use the power supply matched with the device to ensure that the maximum peak optical power is not exceeded. Devices on the heat sink need appropriate heat dissipation; ensure the heat sink has sufficient heat dissipation and thermal conductivity. It is recommended to use indium foil (or similar materials) as the thermal interface between the C - type base and the heat sink surface.
This device is an open - heat - sink diode laser; it can only be operated in a cleanroom environment or a dust - proof housing. Must control the operating temperature and relative humidity to avoid condensation on the laser surface. Avoid any contamination or contact with the laser surface.
ESD protection - Electrostatic discharge is the main cause of accidental product failure. Take extreme preventive measures to prevent ESD. When handling products, use wrist straps, grounded work surfaces and strict anti - static technologies.

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